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Key points of semiconductor precision mold manufacturing process(One)

Introduction

Every link in the process from the signing of the semiconductor precision mold manufacturing order to the delivery of the finished qualified mold to the customer may affect the quality of the mold. The precision mold manufacturing process is controlled by system engineering, and each link must be controlled. It is the core of semiconductor precision mold manufacturing. premise

The guiding ideology of mold parts processing is to formulate corresponding process plans for different mold parts, different materials, different shapes and different technical requirements. The general process of mold parts is: blank preparation-rough machining-semi-finishing-heat treatment (quenching, conditioning)-precision grinding-electrical machining-fitter trimming and surface processing. By controlling each step of the processing process, the required processing accuracy is achieved.

1.Semiconductor Precision Mold Materials And Heat Treatment Control

The heat treatment of mold parts not only allows the parts to obtain the required material hardness, but also stabilizes the size and shape of the parts during processing and after processing. There are different heat treatment methods according to the different materials of the parts and the structural characteristics of the parts. The internal stress of the parts must be heat treated When controlling and formulating the heat treatment process, full consideration must be given to the material’s hardenability, hardenability, overheat sensitivity, and decarburization sensitivity. The pressure quenching process must be used for thin-walled parts.

Characteristics of connector mold accessories
Characteristics of connector mold accessories

(1) Precision mold material selection: In addition to CrWMn, Cr12, 40Cr, GCr15, Cr12MoV, 9Mn2V cemented carbide, for some concave molds and punches with high working intensity and harsh stress, you can choose high thermal stability Alloy steel ASP23, SKD-61, SKD-11, KH51, KH-9 tungsten steel, etc.

(2) Stress relief treatment after quenching: Internal stress remains in the workpiece after quenching, which can easily lead to dimensional changes or even cracking of the workpiece after subsequent finishing. Therefore, the parts should be tempered while hot after quenching to eliminate the quenching stress on complex shapes and many internal and external corners. For workpieces, tempering is not enough to eliminate the quenching stress. Stress relief annealing or multiple aging treatments are required before finishing to fully release the stress.

2.Semiconductor Precision Mold Grinding Process Control

Grinding is a key process in precision mold processing. Finishing grinding must strictly control the occurrence of grinding deformation and grinding cracks, and even control micro-cracks on the surface of the workpiece. The following aspects should be considered when formulating a precision grinding process.

(1) Select a grinding wheel: For mold materials with high tungsten, high vanadium, high molybdenum, high alloy, and high hardness, white steel jade grinding wheels and SDC green silicon carbide grinding wheels can be used; when processing cemented carbide, the quenching hardness is very high When the material is made, the diamond grinding wheel with organic binder is used. The organic binder grinding wheel has good self-sharpening properties. The precision of the ground workpiece is above 0.002mm, and the roughness can reach the requirement of Ra=0.16um. CBN cubic boron nitride grinding wheels are used for finishing on CNC forming grinders, coordinate grinders, and CNC internal and external cylindrical grinders, and the effect is better than other types of grinding wheels. During grinding processing, the grinding wheel must be trimmed in time to keep the grinding wheel sharp. When the grinding wheel is passivated, it will rub, score, and squeeze on the surface of the workpiece, causing burns, microscopic cracks, or grooves on the workpiece surface, affecting the processing accuracy.

(2) Selection of feed amount: The feed amount for precision grinding should be small, the cooling during grinding should be sufficient, and the coolant medium should be selected as much as possible. Parts with a machining allowance within 0.01mm should be ground at a constant temperature.

(3) Workpiece clamping: Shaft parts are characterized by multiple rotating surfaces. Precision machining methods are generally used during the grinding process of internal and external cylindrical grinders. The grinder chuck and tailstock apex are used to clamp and position the workpiece, or the head and tail are used to clamp and position the workpiece. The two centers position the workpiece. At this time, the line connecting the chuck and the center of the center is the center line of the workpiece after grinding. If the center line jumps, the coaxiality of the processed workpiece will not meet the requirements, so the chuck must be prepared before processing. When grinding the inner hole of the wall, consider using a clamping process table, which means leaving an extra thick wall part during turning and cutting it off after the grinding of the inner hole is completed.

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