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Dongguan Jinchen Precision Mold Co., Ltd. is a manufacturer specializing in high-precision mold parts processing and technology research and development. It has more than ten years of production experience and has solved many supply and technical problems for customers.

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Semiconductor precision mold production process points(1)

1,Semiconductor precision mold materials and heat treatment control

Mold parts heat treatment so that parts to obtain the required material hardness at the same time, but also to make the parts processing and processing after the size and shape can be stable, for parts of different materials and parts structural characteristics, there are different ways of heat treatment, the parts must be heat-treated to control the development of the internal stress heat treatment process should be given full consideration by the material quenching quenching overheating sensitivity, as well as decarburization sensitivity, the thin-walled parts to be used in the pressure Quenching process.

(1) precision mold material selection: in addition to the selection of CrWMn, Cr12, 40Cr, GCr15, Cr12MoV, 9Mn2V carbide, for some of the work of high intensity, harsh concave die, convex die, can be selected with high thermal stability and good organization of the alloy steel ASP23, SKD-61, SKD-11, KH51, KH-9 Tungsten steel, etc.

(2) De-stressing after quenching: after quenching the workpiece are retained within the stress, which can easily lead to subsequent finishing changes in the size of the workpiece or even cracking, so the parts quenching should be tempered while hot, to eliminate quenching stress on the shape of the complex, inside and outside of the corner of the workpiece, the tempering is not enough to eliminate the quenching stress, finishing needs to be de-stressed annealing or multiple aging process, to fully release the stress.

2,Semiconductor precision mold grinding process control

Grinding is a key process in precision mold processing. Precision grinding should strictly control the emergence of grinding deformation and grinding cracks, and even control the microcracks on the surface of the workpiece. The development of precision grinding process should consider the following aspects

(1) Select grinding wheel: for the mold material of high tungsten, high vanadium, high molybdenum, high alloy, high hardness characteristics, can choose white steel jade grinding wheel and SDC green silicon carbide grinding wheel; when processing cemented carbide, quenching hardness of the material is very high, the use of organic binder diamond grinding wheel, organic binder wheel self-sharpening is good, grinding the workpiece accuracy of more than 0.002mm, the roughness of up to Ra= CBN cubic boron nitride grinding wheel used in CNC profile grinding machine, coordinate grinding machine, CNC internal and external cylindrical grinding machine for finishing, the effect is better than other kinds of grinding wheels. The grinding wheel should be trimmed in time during the grinding process to keep the wheel sharp, when the wheel is dulled it will slip and rub, scribe and extrude on the surface of the workpiece, resulting in burns on the surface of the workpiece, microcracks or grooves, which will affect the machining accuracy.

(2) Selection of feed: the amount of feed for precision grinding should be small, the cooling in the grinding should be sufficient, try to choose the coolant medium, the machining allowance of 0.01mm within the parts to be thermostatic grinding

(3) workpiece clamping: shaft parts are characterized by multiple rotary surface composition, precision machining methods are generally used in the internal and external cylindrical grinding process, the use of grinding machine chuck and tailstock top clamping positioning workpiece or with the head and tail of the two top positioning of the workpiece, at this time, the chuck and the top of the center of the line is the centerline of the ground workpiece, if the centerline jumps, the coaxiality of the workpiece after machining can not meet the requirements, so before processing Before processing, we should do a good job of concentric detection of the collet and the top of the concentricity and the first and last top of the centering check of the book-wall bore grinding should be considered to use the clamping process table, that is, in the turning process to leave more of a section of the thick-walled part, to be grinded after the completion of the bore excision.

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